Dropping Simulation Induced by BGA Position in Printed Circuit Board for Optical Module Application

Abstract

To obtain higher reliability of printed circuit board (PCB), finite element analysis on dropping state was introduced to point out the influence factors of BGA solder joints. The parameters of simulation included drop angle and location of chip. The results indicated that PCB dropping at 180° had greater damage to solder joints than that at 0° drop since the former case could result in direct ground contact of PCB, thereby causing larger deformation. In addition, compared to chip located in side and corner of PCB, chip located in the center exhibited good reliability during dropping simulation both at 180° and 0°.