MATERIALS SCIENCE
and ENGINEERING

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• 2020 International Conference on Advanced Materials, Electronical and Mechanical Engineering (AMEME 2020)
• ISBN: 978-1-60595-067-9
• ISSN: 2572-889X

It is a pleasure to me to attend the 2020 International Conference on Advanced Materials, Electronical and Mechanical Engineering (AMEME 2020) in Xiamen (China) on September 27–28, 2020.

I am especially honored to be invited as one of the speakers to share with participants my work. For me it is an excellent chance to learn and get advice and suggestion for advance.

I was also glad to be offered the chance to join the reviewing committee which allowed me to have access to the contributions by worldwide colleagues for AMEME 2020. The process was intriguing as well as inspiring.

The reviewers were asked not only to review the papers, but also to offer reports for the author’s improvement. With the hard-work from all, we made sure that only submissions of high academic standards are accepted for presentation in AMEME 2020.

Among all the submissions, 89 papers with innovative ideas and creative thoughts were accepted for final publication. As readers, I believe you will find these papers we recommended both inspiring and interesting.
With this successful experience, I look forward to attending the next AMEME, which I believe would be coming soon for us all.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2020 International Conference on Advanced Materials, Electronical and Mechanical Engineering 
439 North Duke Street 
Lancaster, Pennsylvania 17602 U.S.A. 
Copyright © 2021 by DEStech Publications, Inc. 
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher. 
Manufactured in the U.S.A. 
Main entry under title: 
2020 International Conference on Advanced Materials, Electronical and Mechanical Engineering (AMEME 2020)
ISBN: 978-1-60595-067-9
Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• 2nd International Conference on Advanced Materials Science and Environment Engineering (AMSEE 2017)
• ISBN: 978-1-60595-475-2
• ISSN: 2572-889X

After a whole year's carefully preparation, the 2017 2nd International Conference on Advanced Materials Science and Environment Engineering (AMSEE 2017) is scheduled to take place in Sanya, China from June 25–26, 2017. The Science and Engineering Research Center (SERC) Hong Kong is the sponsor and organizer of this conference. Scientists, academics, engineers and environmentalists from around the world are involved in the study, management and development of materials science and environmental engineering related issues in practice, and in education to come together and exchange ideas. Following the tradition of First AMSEE held in Chiang Mai, Thailand on June 26–27, 2016, AMSEE 2017 will harvest the fruit of success.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2017 2nd International Conference on Advanced Materials Science and Environment Engineering
439 North Duke Street 
Lancaster, Pennsylvania 17602 U.S.A. 
Copyright © 2017 by DEStech Publications, Inc. 
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher. 
Manufactured in the U.S.A. 
Main entry under title: 
2017 2nd International Conference on Advanced Materials Science and Environment Engineering (AMSEE 2017)
ISBN: 978-1-60595-475-2
Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• Joint Conferences of 2017 International Conference on Materials Science and Engineering Application (ICMSEA 2017) and 2017 International Conference on Mechanics, Civil Engineering and Building Materials (MCEBM 2017)
• ISBN: 978-1-60595-448-6
• ISSN: 2572-889X

ICMSEA 2017 is held in Nanjing, China on April 21–23, 2017. Aimed at providing an excellent international academic forum for all the researchers and practitioners, the conference enjoys a wide spread participation among all over the universities and research institutes. Any paper and topic concentrates on related fields of Materials Science and Engineering Application is broadly welcomed. Besides, we also look forward to making the conference perfect circumstances to share resources, exchange opinions and inspire studying.

The 2017 International Conference on Mechanics, Civil Engineering and Building Material (MCEBM 2017) was held from April 21st-23rd, 2017 in Nanjing, China. Aiming at providing an excellent international academic forum for all the researchers and practitioners, the conference enjoys a wide spread participation among all over the universities and research institutes. It provides opportunities for the delegates to exchange new ideas and application experiences, to establish business or research relations and to find global partners for future collaboration. Any paper and topic concentrated on related fields of mechanics, civil engineering and building material is broadly welcomed.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

Joint Conferences of 2017 International Conference on Materials Science and Engineering Application (ICMSEA 2017) and 2017 International Conference on Mechanics, Civil Engineering and Building Materials (MCEBM 2017)
439 North Duke Street
Lancaster, Pennsylvania 17602 U.S.A.
Copyright © 2017 by DEStech Publications, Inc.
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher.
Manufactured in the U.S.A.
Main entry under title:
Joint Conferences of 2017 International Conference on Materials Science and Engineering Application (ICMSEA 2017) and 2017 International Conference on Mechanics, Civil Engineering and Building Materials (MCEBM 2017)
ISBN: 978-1-60595-447-6
Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• International Conference on Transportation Infrastructure and Materials (ICTIM 2017)
• ISBN: 978-1-60595-442-4
• ISSN: 2572-889X

The 2017 International Conference on Transportation Infrastructure and Materials (ICTIM) conference is held in Qingdao, China from June 9 to 12, 2017, which is jointly organized by International Association of Chinese Infrastructure Professionals (IACIP) and Qingdao University of Technology (QUT). This symposium is follow-on to the 2016 ICTIM held in Xi'an, China. The proceeding covers the latest development in the field of transportation infrastructure and materials with various research topics. These topics include, but are not limited to, asphalt and concrete materials, geomaterials, pavement mechanics, geomechanics, ground improvement, pavement construction and design, pavement recycling, smart materials, intelligent construction, sensor and instrumentation, tunneling and underground space technology, embankments, slopes, and retaining walls.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2017 International Conference on Transportation Infrastructure and Materials
DEStech Publications, Inc. 
439 North Duke Street 
Lancaster, Pennsylvania 17602 U.S.A. 
Copyright © 2017 by DEStech Publications, Inc. 
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher. 
Manufactured in the U.S.A. 
Main entry under title: 
2017 International Conference on Transportation Infrastructure and Materials (ICTIM 2017)
ISBN: 978-1-60595-442-4
Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• 2016 International Conference on Applied Mechanics, Mechanical and Materials Engineering (AMMME 2016)
• ISBN: 978-1-60595-409-7
• ISSN: 2572-889X

AMMME 2016, as a major international convention on Applied Mechanics, Mechanical and Materials Engineering, aims at bringing together researchers from the world and providing them with a high-qualified platform for them to share their latest studies and inspiring findings. With passionate participants from the world, would be perfect for you to present your research and find collaboration for your future work.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2016 International Conference on Applied Mechanics, Mechanical and Materials Engineering (AMMME 2016)

DEStech Publications, Inc.
439 North Duke Street Lancaster, Pennsylvania 17602 U.S.A.

Copyright © 2016 by DEStech Publications, Inc.

No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher.

Manufactured in the U.S.A.

Main entry under title:
2016 International Conference on Applied Mechanics, Mechanical and Materials Engineering (AMMME 2016)

ISBN: 978-1-60595-409-7

Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• International Conference on Advanced Materials Science and Technology (AMST 2016)
• ISBN: 978-1-60595-397-7
• ISSN: 2572-889X

Welcome to the official website for 2016 International Conference on Advanced Materials Science and Technology(AMST2016). This year, the AMST2016 will be held in October in Shenzhen, China. It will last for two days from October 30-31, 2016. By providing a favorable environment, we want our participants to be engaged in discussing and sharing their views and ideas on recently hot issues in this field as much as they could, because we believe that the fast advance and timely application of our studies inAdvanced Materials Science and Technology is achievable only by the full devotion of its researchers.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2016 International Conference on Advanced Materials Science and Technology

DEStech Publications, Inc.
439 North Duke Street Lancaster, Pennsylvania 17602 U.S.A.

Copyright © 2016 by DEStech Publications, Inc.

No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher.

Manufactured in the U.S.A.

Main entry under title:
2016 International Conference on Advanced Materials Science and Technology (AMST 2016)

ISBN: 978-1-60595-397-7

Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• International Conference on Intelligent Manufacturing and Materials (ICIMM 2016)
• ISBN: 978-1-60595-363-2
• ISSN: 2572-889X

The International Conference on Intelligent Manufacturing and Materials (ICIMM 2016) creates an academic platform for international experts and researchers in relative fields to share and exchange the latest research results and problem solving solutions. ICIMM 2016 has collected advanced results and trends in the field of Electrical and Electronic Engineering, Manufacturing Process, Control Engineering, Materials, Computers and Information technology.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2016 International Conference on Intelligent Manufacturing and Materials
DEStech Publications, Inc. 
439 North Duke Street 
Lancaster, Pennsylvania 17602 U.S.A. 
Copyright © 2016 by DEStech Publications, Inc. 
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher. 
Manufactured in the U.S.A. 
Main entry under title: 
2016 International Conference on Intelligent Manufacturing and Materials (ICIMM 2016)
ISBN: 978-1-60595-363-2
Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• 5th International Conference on Materials Engineering for Advanced Technologies (ICMEAT 2016)
• ISBN: 978-1-60595-373-1
• ISSN: 2572-889X

2016 5th International Conference on Materials Engineering for Advanced Technologies (ICMEAT 2016) will be held on August 5–6, 2016, Quebec City, Canada. ICMEAT 2016 is sponsored by American Applied Sciences Research Institute, USA and technical co-sponsored by DEStech Publications, USA. The proceedings of ICMEAT 2016 will be published by DEStech Publications, USA. 2015 4th International Conference on Materials Engineering for Advanced Technologies (ICMEAT 2015) has been held in London, England, June 27–28, 2015. All ICMEAT 2015 Proceedings papers have been indexed by CPCI-S. The proceeding of ICMEAT 2016 not only includes papers of ICMEAT 2016, also includes papers from ICCT 2016, MBSM 2016, and SMTA 2016. Three of the conferences, including 2016 3rd International Conference on Communication Technology (ICCT 2016), the 2nd International Conference on the Mechanics of Biological Systems and Materials (MBSM 2016), and 2016 2nd International Conference on Circuits and Systems (CAS 2016) will be held on August 5–6, 2016, Quebec City, Canada. The goal of ICMEAT 2016 is to bring together the researchers from academia and industry as well as practitioners to share ideas, problems and solutions relating to the multifaceted aspects of Materials Engineering for Advanced Technologies. 

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI. 

2016 5th International Conference on Materials Engineering for Advanced Technologies
DEStech Publications, Inc. 
439 North Duke Street 
Lancaster, Pennsylvania 17602 U.S.A. 
Copyright © 2016 by DEStech Publications, Inc. 
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher. 
Manufactured in the U.S.A. 
Main entry under title: 
2016 5th International Conference on Materials Engineering for Advanced Technologies (ICMEAT 2016)
ISBN: 978-1-60595-373-1
Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• 3rd International Conference on Materials Science and Mechanical Engineering (ICMSME 2016)
• ISBN: 978-1-60595-391-5
• ISSN: 2572-889X

2016 3rd International Conference on Materials Science and Mechanical Engineering (ICMSME 2016) will be held on September 29–30, Windsor. We invite you to attend ICMSME 2016 conference. 2014 2nd International Conference on Materials Science and Mechanical Engineering (ICMSME 2014) has been held on May 31-June 1, 2014, Taipei, Taiwan very successfully ICMSME 2016 is sponsored by Singapore Management and Sports Science Institute, Singapore and technical co-sponsored by DEStech Publications, USA. Aimed to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Materials Science and Mechanical Engineering, ICMSME 2016 will provide a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Materials Science and Mechanical Engineering. 

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI. 

2016 3rd International Conference on Materials Science and Mechanical Engineering
DEStech Publications, Inc. 
439 North Duke Street 
Lancaster, Pennsylvania 17602 U.S.A. 
Copyright © 2016 by DEStech Publications, Inc. 
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher. 
Manufactured in the U.S.A. 
Main entry under title: 
2016 3rd International Conference on Materials Science and Mechanical Engineering (ICMSME 2016)
ISBN: 978-1-60595-391-5
Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• International Conference on Materials, Manufacturing and Mechanical Engineering (MMME 2016)
• ISBN: 978-1-60595-413-4
• ISSN: 2572-889X

The aim objective of the 2016 International Conference on Materials, Manufacturing and Mechanical Engineering (MMME2016) is to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Materials, Manufacturing and Mechanical Engineering. 2016 International Conference on Materials, Manufacturing and Mechanical Engineering (MMME2016) will be held in Beijing China during December 30-31, 2016.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2016 International Conference on Materials, Manufacturing and Mechanical Engineering

DEStech Publications, Inc.
439 North Duke Street Lancaster, Pennsylvania 17602 U.S.A.

Copyright © 2016 by DEStech Publications, Inc.

No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher.

Manufactured in the U.S.A.

Main entry under title:
2016 International Conference on Materials, Manufacturing and Mechanical Engineering (MMME 2016)

ISBN: 978-1-60595-413-4

Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• International Conference on Material Science and Civil Engineering (MSCE 2016)
• ISBN: 978-1-60595-378-6
• ISSN: 2572-889X

2016 International Conference on Material Science and Civil Engineering (MSCE 2016) was held on August 5–7, 2016 in Guilin, China. The main objective of the conference was to provide a platform for scientists, researchers, and engineers from different parts of the world to get together to discuss, present, and share their research findings and results on most recent developments in Material Science and Civil Engineering.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2016 International Conference on Material Science and Civil Engineering 
439 North Duke Street 
Lancaster, Pennsylvania 17602 U.S.A. 
Copyright © 2016 by DEStech Publications, Inc. 
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher. 
Manufactured in the U.S.A. 
Main entry under title: 
2017 International Conference on Material Science and Civil Engineering (MSCE 2016)
ISBN: 978-1-60595-378-6
Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.00
• 3rd International Conference on Smart Materials and Nanotechnology in Engineering
• ISBN: 978-1-60595-338-0
• ISSN: 2572-889X

SMNE 2016 will be one of the most comprehensive conferences, focusing on the various aspects of Smart Materials and Nanotechnology in Engineering. The goal of this conference is to bring together the researchers from academia and industry as well as practitioners to share ideas, problems and solutions relating to the multifaceted aspects of Smart Materials and Nanotechnology in Engineering. It is certain that our conference provides a chance for academic and industry professionals to discuss the recent progresses in those areas of New Materials and Advanced Materials; Product Design and Manufacturing Technology; Mechatronics, Intelligent Computing and Algorithm; Biomaterials and Engineering and so on.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2016 3rd International Conference on Smart Materials and Nanotechnology in Engineering 
439 North Duke Street 
Lancaster, Pennsylvania 17602 U.S.A. 
Copyright © 2016 by DEStech Publications, Inc. 
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher. 
Manufactured in the U.S.A. 
Main entry under title: 
2017 3rd International Conference on Smart Materials and Nanotechnology in Engineering (SMNE 2016)
ISBN: 978-1-60595-338-0
Permission for publication outside of this Conference Proceeding must be given by the Publisher.

• Email [email protected] to purchase full access to this entire journal issue for only $25.002nd International Conference on Material Engineering and Application (ICMEA 2015)
• ISBN: 978-1-60595-323-6
• ISSN: 2572-889X

The 2015 International Conference on Material Engineering and Application (ICMEA 2015) was held in Wuhan, China from October 17 to October 18, 2015. The conference aims to provide an excellent international academic forum for all the researchers, practitioner, students and teachers in related fields to share their knowledge and results in theory, methodology and application on material science and its application. ICMEA 2015 features unique mixed topics of materials and its application. ICMEA 2015 proceeding tends to collect the most up-to-date, comprehensive, and worldwide state-of-art knowledge on materials and its application. All accepted papers have been submitted to strict peer-review by 2–4 expert referees, and selected based on originality, significance and clarity for the purpose of the conference. The conference program is extremely rich, profound and featuring high-impact presentations of selected papers and additional late-breaking contributions. We sincerely hope that the conference would not only show the participants a broad overview of the latest research results on related fields, but also provide them with a significant platform for academic connection and exchange. 

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2015 2nd International Conference on Material Engineering and Application
DEStech Publications, Inc. 
439 North Duke Street 
Lancaster, Pennsylvania 17602 U.S.A. 
Copyright © 2015 by DEStech Publications, Inc. 
No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the publisher. 
Manufactured in the U.S.A. 
Main entry under title: 
2015 2nd International Conference on Material Engineering and Application (ICMEA 2015)
ISBN: 978-1-60595- 323-6
Permission for publication outside of this Conference Proceeding must be given by the Publisher.