2nd International Conference on Applied Mathematics, Simulation and Modelling (AMSM 2017)


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  • 2nd International Conference on Applied Mathematics, Simulation and Modelling
  • ISBN: 978-1-60595-480-6
  • ISSN: 2475-885X

Encouraged by the great success of the previous editions of 2016 International Conference on Applied Mathematics, Simulation and Modelling (AMSM 2016), which was regarded as a global academic feast during the period of May 28–29, 2016 in Beijing, China, AMSM 2017 is arriving. We are pleased to share with you that the proceedings of AMSM 2016 have been successfully indexed by CPCI-S. The goal of AMSM 2017 is to provide an inter-disciplinary platform for researchers to exchange ideas, present results, share experience, stimulate new research, and foster collaborations among researchers, professionals, and application developers on the various aspects of Applied Mathematics, Simulation and Modelling.

As a standard, DEStech will submit the technical science conference proceedings to be indexed in EI (Citation and Compendex). DEStech will submit the technical science conference proceedings to EI, Clarivate Analytics (formerly Thomson Reuters Web of Science) and CNKI Scholar for worldwide online citation within one month after the Proceedings is completed. Please note that DEStech does not submit Proceedings of Social Science to EI since they will not be accepted for EI Compendex. However, DEStech will submit proceedings of Social Science to Thomson Reuters Conference Proceedings Citation Index-Social Science & Humanities (CPCI-SSH). We also caution our editors that Proceedings containing plagiarized material and Proceedings advertised that they will definitely be accepted by EI will be rejected by EI.

2017 2nd International Conference on Applied Mathematics, Simulation and Modelling
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Main entry under title: 
2017 2nd International Conference on Applied Mathematics, Simulation and Modelling (AMSM 2017)
ISBN: 978-1-60595-480-6
Permission for publication outside of this Conference Proceeding must be given by the Publisher.