The Research on Laser Direct Writing Circuit Board Materials

Abstract

This paper discusses the Structure and preparation of laser direct writing process circuit board materials and key devices, introduces the laser chemical vapor deposition of circuit board material, laser-induced liquid reactive deposition circuit board materials and laser cladding wiring, in order to avoid laser excessive damage to the substrate surface. The overall surface of the substrate coated with a Film of heat actuable adhesive, then evenly spread a layer of metal powder, after roll, using laser heating to activate adhesive film, on the ceramic substrate and glass substrate, cladding and preparation to become line material and various passive components materials, that is to say, direct write a line and thick film resistive device on the circuit board, study the parameters and optimization of laser micro-cladding IC material manufacturing equipment, with silver and Ag-Pd alloy powder as a conductive metal and organic film material as an organic slurry system of binder phase, can prepare metal wire material in an organic epoxy board, having a thickness of 20ï­m, the minimum width may be less than 80ï­m, the conductivity 10-5.