The Computer Heat Simulation of LED Package
Abstract
LED is a new generation of solid cold light source, LED packaging technology is the decision key to enter the field of general lighting one of the key technologies. With LED brightness and luminous efficiency continues to improve, it will also be more and more challenging. On the one hand, the package must have the largest LED light extraction rate, so that light losses to a minimum. On the other hand, the package must have the best thermal performance LED, if the cooling efficiency, LED brightness will decrease, and also shorten the LED life, solve the heat problem has become a power type LED applications Prerequisite. Through thermal simulation software Solidworks, this article did a simulation on some typical LED package materials, and then considered a various factors based on the simulation results, the right requirements of high-power light-emitting materials were founded, so that high-power LED lighting devices get popularity.
DOI
10.12783/dtmse/icmea2015/7358
10.12783/dtmse/icmea2015/7358
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